Invention Grant
- Patent Title: Adhesive pads for footwear
- Patent Title (中): 鞋类胶粘垫
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Application No.: US12029363Application Date: 2008-02-11
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Publication No.: US07727608B2Publication Date: 2010-06-01
- Inventor: Kathleen Cunningham
- Applicant: Kathleen Cunningham
- Applicant Address: US IL Berwyn
- Assignee: The Blister Sister, Inc.
- Current Assignee: The Blister Sister, Inc.
- Current Assignee Address: US IL Berwyn
- Agency: Beem Patent Law Firm
- Main IPC: B32B9/00
- IPC: B32B9/00 ; B32B33/00 ; A61F13/00 ; A61F13/06 ; A61L15/00
Abstract:
An adhesive pad kit for footwear has a schematic having an indication of footwear. The adhesive pad kit has at least two pairs of thin adhesive backed pads. Each pad in the first pair has a predetermined shape having a length and a width. The length is at least four times the width. The indication depicts an operative location for at least one of the pads on the footwear.
Public/Granted literature
- US20080131682A1 Adhesive Pads for Footwear Public/Granted day:2008-06-05
Information query
