Invention Grant
US07727815B2 Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
失效
相变焊料中的反应性吸附剂以抑制接触表面的氧化
- Patent Title: Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
- Patent Title (中): 相变焊料中的反应性吸附剂以抑制接触表面的氧化
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Application No.: US10954646Application Date: 2004-09-29
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Publication No.: US07727815B2Publication Date: 2010-06-01
- Inventor: Chad A. Kumaus , Carl Deppisch , Daewoong Suh , Ashay A. Dani
- Applicant: Chad A. Kumaus , Carl Deppisch , Daewoong Suh , Ashay A. Dani
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change temperature that is about the normal operating temperature range of the IC, to bind absorbed and dissolved oxygen in the two phase solder interface material at or near the air to solder surface. Over time this chemical binding action results in an oxide layer at the air to solder surface that slows the rate of oxygen absorption into the solder interface material, and thus reduces the harmful oxidation of the solder to IC package interface and the solder to heat sink interface.
Public/Granted literature
- US20060065974A1 Reactive gettering in phase change solders to inhibit oxidation at contact surfaces Public/Granted day:2006-03-30
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