Invention Grant
- Patent Title: Ultra shallow junction formation by solid phase diffusion
- Patent Title (中): 通过固相扩散形成超浅结
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Application No.: US11258469Application Date: 2005-10-24
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Publication No.: US07727845B2Publication Date: 2010-06-01
- Inventor: Chih-Hao Wang , Yen-Ping Wang , Steve Ming Ting , Yi-Chun Huang
- Applicant: Chih-Hao Wang , Yen-Ping Wang , Steve Ming Ting , Yi-Chun Huang
- Applicant Address: TW HsinChu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW HsinChu
- Agency: Tung & Associates
- Main IPC: H01L21/8242
- IPC: H01L21/8242 ; H01L21/336 ; H01L21/20

Abstract:
An ultra shallow junction (USJ) FET device and method for forming the same with improved control over SDE or LDD doped region interfaces to improve device performance and reliability is provided, the method including providing a semiconductor substrate; forming a gate structure comprising a gate dielectric, an overlying gate electrode, and first offset spacers adjacent either side of the gate electrode; forming at least one doped semiconductor layer comprising dopants over a respective source and drain region adjacent the respective first offset spacers; forming second offset spacers adjacent the respective first offset spacers; and, thermally treating the at least one semiconductor layer to cause out-diffusion of the dopants to form doped regions in the semiconductor substrate.
Public/Granted literature
- US20070093033A1 Ultra shallow junction formation by solid phase diffusion Public/Granted day:2007-04-26
Information query
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