Invention Grant
- Patent Title: Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
- Patent Title (中): 用激光雕刻方法和组合物增加主体聚合物的导热性
-
Application No.: US10677092Application Date: 2003-09-30
-
Publication No.: US07728048B2Publication Date: 2010-06-01
- Inventor: Brian Labrec
- Applicant: Brian Labrec
- Applicant Address: US MA Burlington
- Assignee: L-1 Secure Credentialing, Inc.
- Current Assignee: L-1 Secure Credentialing, Inc.
- Current Assignee Address: US MA Burlington
- Agency: Mintz, Levin, Cohn, Ferris, Glovsky and Popeo, P.C.
- Main IPC: C08F2/46
- IPC: C08F2/46 ; B32B26/00 ; G06K5/00 ; G03C1/491
Abstract:
the invention provides a composition having laser engraving properties, comprising a host material and a laser enhancing additive. The host material comprises a material, such as a polymer, modified by a first process, whereby the host material as modified by the first process has increased thermal conductivity as compared to the host material before the first process. The laser enhancing additive comprises a first quantity of at least one of copper potassium iodide (CuKI3), Copper Iodide (CuI), potassium iodide (KI), sodium iodide (NaI), and aluminum iodide (AlI), and a second quantity of at least one substance selected from the group consisting of zinc sulfide (ZnS), barium sulfide (BaS), alkyl sulfonate, and thioester.
Public/Granted literature
- US20040198858A1 Increasing thermal conductivity of host polymer used with laser engraving methods and compositions Public/Granted day:2004-10-07
Information query
