Invention Grant
- Patent Title: Thermal interface material and method of producing the same
- Patent Title (中): 热界面材料及其制造方法
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Application No.: US11309896Application Date: 2006-10-24
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Publication No.: US07728052B2Publication Date: 2010-06-01
- Inventor: Ching-Tai Cheng , Nien-Tien Cheng
- Applicant: Ching-Tai Cheng , Nien-Tien Cheng
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Jeffrey T. Knapp
- Priority: CN200610033261 20060121
- Main IPC: C08K3/22
- IPC: C08K3/22

Abstract:
A thermal interface material (10) includes 100 parts by weight of a silicone oil (11) and 800˜1200 parts by weight of a metal powder (12) mixed into the silicone oil. An outer surface of each metal particle (121) of the metal powder is coated with a metal oxide layer (122). A method of producing the thermal interface material includes steps of: (1) applying a layer of organo coupling agent on the metal powder; (2) heating the metal powder at a temperature between 200 to 300° C. to coat a metal oxide layer on an outer surface of the metal powder; and (3) adding the metal powder with the coated metal oxide layer to a silicone oil. The thermal interface material has an excellent thermal conductivity and an excellent electrical insulating property.
Public/Granted literature
- US20070187641A1 Thermal interface material and method of producing the same Public/Granted day:2007-08-16
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