Invention Grant
- Patent Title: Solventless silicone pressure-sensitive adhesive composition
- Patent Title (中): 无溶剂硅氧烷压敏粘合剂组合物
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Application No.: US12057595Application Date: 2008-03-28
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Publication No.: US07728080B2Publication Date: 2010-06-01
- Inventor: Shunji Aoki
- Applicant: Shunji Aoki
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-091031 20070330
- Main IPC: C08L83/05
- IPC: C08L83/05 ; C08L83/07 ; C08G77/00 ; C08G77/38

Abstract:
A solventless silicone pressure-sensitive adhesive composition is provided. The composition includes (A) a polyorganosiloxane with a polymerization degree of 300 to 2,000 and having at least two alkenyl group-containing organic groups, (B) a polyorganohydrosiloxane having at least three silicon-bonded hydrogen atoms, (C) a polydiorganosiloxane having alkenyl groups at both terminals, (D) a polydiorganosiloxane having SiH groups at both terminals, (E) a polyorganosiloxane composed of R23SiO1/2 units and SiO2 units (R2 is a monovalent hydrocarbon group), and (F) a platinum-based catalyst. The composition enables the prevention of problems caused by residual or volatilized organic substances, such as the absorption of ultraviolet radiation or the like, and also enables ready removal of the composition without deforming or damaging the adherend.
Public/Granted literature
- US20080242807A1 SOLVENTLESS SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION Public/Granted day:2008-10-02
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