Invention Grant
- Patent Title: Phase change memory device and method of manufacturing the device
- Patent Title (中): 相变存储器件及其制造方法
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Application No.: US11518172Application Date: 2006-09-11
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Publication No.: US07728321B2Publication Date: 2010-06-01
- Inventor: Tsutomu Hayakawa
- Applicant: Tsutomu Hayakawa
- Applicant Address: JP Tokyo
- Assignee: Elipida Memory Inc.
- Current Assignee: Elipida Memory Inc.
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-264484 20050912
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
The invention provides a novel structure of a phase change memory device. In the phase change memory device of the invention, an electrode acting as a radiating fin does not exit immediately above a phase change area of a phase change layer (115). A heater electrode (111) and landing electrode layer (113a, 114a) both contact the bottom of the phase change layer (115) made of GST. The landing electrode layer (113a, 114a) contacts the bottom of the phase change layer (115) to partially overlap in a region off from a portion immediately above the contact face (Y) of the phase change layer and heater electrode. The contact electrode (116, 118) is directly connected to the landing electrode layer (113a, 114a) in a portion off from a portion immediately above the heater electrode (111). The phase change layer of GST or the like does not exist immediately below the contact electrode.
Public/Granted literature
- US20070069249A1 Phase change memory device and method of manufacturing the device Public/Granted day:2007-03-29
Information query
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