Invention Grant
US07728402B2 Semiconductor devices including schottky diodes with controlled breakdown
有权
半导体器件包括具有受控击穿的肖特基二极管
- Patent Title: Semiconductor devices including schottky diodes with controlled breakdown
- Patent Title (中): 半导体器件包括具有受控击穿的肖特基二极管
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Application No.: US11496842Application Date: 2006-08-01
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Publication No.: US07728402B2Publication Date: 2010-06-01
- Inventor: Qingchun Zhang , Sei-Hyung Ryu , Anant Agarwal
- Applicant: Qingchun Zhang , Sei-Hyung Ryu , Anant Agarwal
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec
- Main IPC: H01L27/095
- IPC: H01L27/095 ; H01L29/47 ; H01L29/812 ; H01L31/07

Abstract:
A semiconductor device includes a semiconductor layer having a first conductivity type, a metal contact on the semiconductor layer and forming a Schottky junction with the semiconductor layer, and a semiconductor region in the semiconductor layer. The semiconductor region and the semiconductor layer form a first p-n junction in parallel with the Schottky junction. The first p-n junction is configured to generate a depletion region in the semiconductor layer adjacent the Schottky junction when the Schottky junction is reversed biased to thereby limit reverse leakage current through the Schottky junction. The first p-n junction is further configured such that punch-through of the first p-n junction occurs at a lower voltage than a breakdown voltage of the Schottky junction when the Schottky junction is reverse biased.
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