Invention Grant
- Patent Title: Integrated circuit package system including shield
- Patent Title (中): 集成电路封装系统包括屏蔽
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Application No.: US11419748Application Date: 2006-05-22
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Publication No.: US07728417B2Publication Date: 2010-06-01
- Inventor: Marcos Karnezos
- Applicant: Marcos Karnezos
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A method of manufacture of an integrated circuit package system which includes providing a substrate and attaching a first device to the substrate. Attaching a shield to the substrate. Processing the shield to form apertures and configuring the shield to block electromagnetic energy that passes through the apertures.
Public/Granted literature
- US20070108582A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING SHIELD Public/Granted day:2007-05-17
Information query
IPC分类:
