Invention Grant
US07728432B2 Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces
有权
由（111），（200）和（511）表面组成的狭窄和宽铜互连
- Patent Title: Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces
- Patent Title (中): 由（111），（200）和（511）表面组成的狭窄和宽铜互连
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Application No.: US11185937Application Date: 2005-07-21
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Publication No.: US07728432B2Publication Date: 2010-06-01
- Inventor: Toshiyuki Takewaki , Hiroyuki Kunishima
- Applicant: Toshiyuki Takewaki , Hiroyuki Kunishima
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2004-229779 20040805
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor device includes: a semiconductor substrate; an insulating film provided on the semiconductor substrate; a plurality of copper interconnections provided on the same level in the insulating film. The copper interconnection includes: a first copper interconnection having a relatively narrow width; and a second copper interconnection having a relatively wide width. The first copper interconnection has the top surface thereof principally composed of copper, and the second copper interconnection has the top surface thereof principally composed of copper.
Public/Granted literature
- US20060027931A1 Semiconductor device and method fabricating the same Public/Granted day:2006-02-09
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