Invention Grant
- Patent Title: Radiation-emitting component provided with metallic injected-molded carrier
- Patent Title (中): 辐射发射部件配有金属注射成型载体
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Application No.: US11518401Application Date: 2006-09-08
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Publication No.: US07728507B2Publication Date: 2010-06-01
- Inventor: Matthias Winter , Harald Jäger
- Applicant: Matthias Winter , Harald Jäger
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Fish & Richardson P.C.
- Priority: DE102005047167 20050930; DE102006032415 20060713
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A process is specified for producing a radiation-emitting component comprising a housing body and a carrier for a radiation-emitting semiconductor body, in which the carrier is produced in an injection molding process from a molding compound containing a metal.
Public/Granted literature
- US20070075451A1 Process for producing a radiation-emitting component Public/Granted day:2007-04-05
Information query
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