Invention Grant
- Patent Title: Method for assembling electrical connecting apparatus
- Patent Title (中): 电气连接装置的组装方法
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Application No.: US12091207Application Date: 2005-10-24
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Publication No.: US07728608B2Publication Date: 2010-06-01
- Inventor: Yoshiei Hasegawa
- Applicant: Yoshiei Hasegawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Naisha Nihon Micronics
- Current Assignee: Kabushiki Naisha Nihon Micronics
- Current Assignee Address: JP Tokyo
- Agency: Stolowitz Ford Cowger LLP
- Priority: JPPCT/JP2005/019850 20051024
- International Application: PCT/JP2005/019850 WO 20051024
- International Announcement: WO2007/046153 WO 20070426
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A method for assembling an electrical connecting apparatus having a support member, a probe board, and spacers arranged between the support member and the probe board. A height of at least either each abutting part of the support member or each abutting part of the probe board facing the abutting part is measured, and a length of each of the plurality of spacers is measured. Based on measurement values obtained by these measurements, a spacer appropriate for maintaining tips of numerous probes provided on the probe board on the same plane is selected for each pair of the both abutting parts.
Public/Granted literature
- US20090284273A1 METHOD FOR ASSEMBLING ELECTRICAL CONNECTING APPARATUS Public/Granted day:2009-11-19
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