Invention Grant
- Patent Title: Compressive conductors for semiconductor testing
- Patent Title (中): 用于半导体测试的压缩导体
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Application No.: US11671942Application Date: 2007-02-06
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Publication No.: US07728611B1Publication Date: 2010-06-01
- Inventor: Timothy L. Kraynak
- Applicant: Timothy L. Kraynak
- Applicant Address: US KS Kansas City
- Assignee: Interconnect Devices, Inc.
- Current Assignee: Interconnect Devices, Inc.
- Current Assignee Address: US KS Kansas City
- Agency: Pepper Hamilton, LLP
- Main IPC: G01R31/02
- IPC: G01R31/02 ; H01R13/24

Abstract:
An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly. The interconnect assembly comprises a plurality of electrical conductors, the plurality of conductors arranged in a spaced arrangement, the spaced arrangement of the conductors substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays and a carrier, including a socket and a retainer. The socket includes a plurality of apertures each receiving an upper portion of one of the plurality of conductors and the retainer includes a plurality of apertures each receiving a lower portion of one of the plurality of conductors; and the respective apertures are aligned axially with each other.
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