Invention Grant
- Patent Title: Shielding of integrated circuit package with high-permeability magnetic material
- Patent Title (中): 用高磁导率磁性材料屏蔽集成电路封装
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Application No.: US11418083Application Date: 2006-05-05
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Publication No.: US07728702B2Publication Date: 2010-06-01
- Inventor: Jonathan Gorrell
- Applicant: Jonathan Gorrell
- Applicant Address: US VI St. Thomas
- Assignee: Virgin Islands Microsystems, Inc.
- Current Assignee: Virgin Islands Microsystems, Inc.
- Current Assignee Address: US VI St. Thomas
- Agency: Davidson Berquist Jackson & Gowdey LLP
- Main IPC: H01P7/00
- IPC: H01P7/00
Abstract:
A device includes at least one ultra-small resonant structure; and shielding constructed and adapted to shield at least a portion of said ultra-small resonant structure with a high-permeability magnetic material. The magnetic material is formed from a substance selected from a non-conductive magnetic oxide such as a ferrite; a cobaltite, a chromite, and a manganite. The magnetic material may be mumetal, permalloy, Hipernom, HyMu-80, supermalloy, supermumetal, nilomag, sanbold, Mo-Permalloy, Ultraperm, or M-1040.
Public/Granted literature
- US20080067941A1 Shielding of integrated circuit package with high-permeability magnetic material Public/Granted day:2008-03-20
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