Invention Grant
- Patent Title: ID label, ID tag, and ID card
- Patent Title (中): ID标签,ID标签和身份证
-
Application No.: US12336611Application Date: 2008-12-17
-
Publication No.: US07728734B2Publication Date: 2010-06-01
- Inventor: Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
- Applicant: Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
- Applicant Address: unknown Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee Address: unknown Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-027699 20040204
- Main IPC: G08B13/14
- IPC: G08B13/14

Abstract:
In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to a decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.
Public/Granted literature
- US20090128338A1 ID LABEL, ID TAG, AND ID CARD Public/Granted day:2009-05-21
Information query