Invention Grant
- Patent Title: Combined microphone and radio-frequency antenna modules
- Patent Title (中): 组合麦克风和射频天线模块
-
Application No.: US11968676Application Date: 2008-01-03
-
Publication No.: US07728779B2Publication Date: 2010-06-01
- Inventor: Hans Peter Körner
- Applicant: Hans Peter Körner
- Applicant Address: SE
- Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee Address: SE
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
Electronic devices and wireless communication terminals include a unitary circuit board on which a radio-frequency (RF) antenna and a microphone are attached. The RF antenna includes a radiating plane and a ground plane. A feed line on the circuit board is connected to the radiating plane, and a ground line on the circuit board is connected to the ground plane. The microphone and the RF antenna are spaced apart on the circuit board by a distance of less than a half wavelength of a resonant frequency of the radiating plane. The microphone generates a microphone signal through a pair of microphone lines on the circuit board.
Public/Granted literature
- US20090174610A1 COMBINED MICROPHONE AND RADIO-FREQUENCY ANTENNA MODULES Public/Granted day:2009-07-09
Information query