Invention Grant
- Patent Title: System including a buffered memory module
- Patent Title (中): 系统包括缓冲存储器模块
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Application No.: US11460899Application Date: 2006-07-28
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Publication No.: US07729151B2Publication Date: 2010-06-01
- Inventor: Ely Tsern , Ian Shaeffer , Craig Hampel
- Applicant: Ely Tsern , Ian Shaeffer , Craig Hampel
- Applicant Address: US CA Los Altos
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Los Altos
- Agency: Vierra Magen Marcus & DeNiro LLP
- Main IPC: G11C5/02
- IPC: G11C5/02

Abstract:
A system includes a master device and a first memory module having a plurality of integrated circuit memory devices and a plurality of integrated circuit buffer devices that operate in first and second modes of operation (bypass mode). In a first mode of operation, a first memory module provides read data from the plurality of integrated circuit memory devices (via a integrated circuit buffer device) on a first signal path to the master and a second memory module simultaneously provides read data from its plurality of integrated circuit memory devices (via another integrated circuit buffer device on the second module) on a third signal path coupled to the master device. In a second mode of operation, the first memory module provides first read data from its plurality of integrated circuit memory devices (via the integrated circuit buffer device) on the first signal path and second read data from its plurality of integrated circuit memory devices (via the integrated circuit buffer device) on a second signal path that is coupled to a second memory module. An integrated circuit buffer device in the second memory module then bypasses the second read data from the second signal path and provides the second read data on a third signal path coupled to the master device.
Public/Granted literature
- US20070088995A1 SYSTEM INCLUDING A BUFFERED MEMORY MODULE Public/Granted day:2007-04-19
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