Invention Grant
- Patent Title: Semiconductor laser device and fabrication method for the same
- Patent Title (中): 半导体激光器件及其制造方法相同
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Application No.: US12167559Application Date: 2008-07-03
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Publication No.: US07729401B2Publication Date: 2010-06-01
- Inventor: Toru Takayama , Tomoya Sato , Isao Kidoguchi
- Applicant: Toru Takayama , Tomoya Sato , Isao Kidoguchi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-197119 20070730
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
The semiconductor laser device includes a cavity structure having a first clad layer, an active layer and a second clad layer formed on a substrate. The second clad layer has a stripe portion extending between the front end face from which laser light is extracted and the rear end face opposite to the front end face. The stripe portion has a first region located closer to the front end face, a second region located closer to the rear end face and a change region whose width changes located between the first and second regions. The effective refractive index difference between the inside and outside of the stripe portion in the change region is greater than that in the first region.
Public/Granted literature
- US20090034573A1 SEMICONDUCTOR LASER DEVICE AND FABRICATION METHOD FOR THE SAME Public/Granted day:2009-02-05
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