Invention Grant
- Patent Title: Substrate processing system, and method of control therefor, control program, and storage medium
- Patent Title (中): 基板处理系统及其控制方法,控制程序和存储介质
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Application No.: US10551225Application Date: 2004-03-26
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Publication No.: US07729798B2Publication Date: 2010-06-01
- Inventor: Yasushi Hayashida , Yoshitaka Hara
- Applicant: Yasushi Hayashida , Yoshitaka Hara
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2003-099350 20030402
- International Application: PCT/JP2004/004383 WO 20040326
- International Announcement: WO2004/090972 WO 20041021
- Main IPC: G06F7/00
- IPC: G06F7/00

Abstract:
A transfer schedule SA and a transfer schedule SB for an A lot and a B lot different from each other are generated on a transfer control table, the succeeding transfer schedule SB is moved ahead in the direction of a time axis within a range over which it does not interfere with the transfer schedule SA for the preceding A lot to make the start timing for the succeeding transfer schedule SB become earlier than the end timing for the transfer schedule for the preceding A lot, so that the transfer schedule SA and the transfer schedule SB are executed in parallel, thereby improving the throughput a wafer transfer process.
Public/Granted literature
- US20060228195A1 Substrated processing system, and method of control therefor, control program and storage medium Public/Granted day:2006-10-12
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