Invention Grant
- Patent Title: Method for manufacturing a surface acoustic wave device
- Patent Title (中): 声表面波装置的制造方法
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Application No.: US11329460Application Date: 2006-01-11
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Publication No.: US07730596B2Publication Date: 2010-06-08
- Inventor: Michio Kadota , Takeshi Nakao , Masakazu Mimura
- Applicant: Michio Kadota , Takeshi Nakao , Masakazu Mimura
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2001-315181 20011012; JP2002-291991 20021004
- Main IPC: H01L41/22
- IPC: H01L41/22 ; H01L41/00

Abstract:
A method of manufacturing a surface acoustic wave device having a high electromechanical coefficient and reflection coefficient, and also having an improved frequency-temperature characteristic is achieved by forming a SiO2 film on an IDT so as to prevent cracking from occurring on a surface of the SiO2 film so that desired properties can be reliably obtained. The surface acoustic wave device includes at least one IDT, which is composed of a metal or an alloy having a density higher than that of Al and is formed on a 25° to 55° rotation-Y plate X propagation LiTaO3 substrate, and a SiO2 film disposed on the LiTaO3 substrate so as to cover the at least one IDT for improving the frequency-temperature characteristic.
Public/Granted literature
- US20060112537A1 Surface acoustic wave device Public/Granted day:2006-06-01
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