Invention Grant
- Patent Title: High capacity pick and place process
- Patent Title (中): 高容量的拾放过程
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Application No.: US12052948Application Date: 2008-03-21
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Publication No.: US07730611B2Publication Date: 2010-06-08
- Inventor: Ulf Becker , David Halk
- Applicant: Ulf Becker , David Halk
- Applicant Address: US GA Alpharetta
- Assignee: Siemens Energy & Automation, Inc.
- Current Assignee: Siemens Energy & Automation, Inc.
- Current Assignee Address: US GA Alpharetta
- Agent Frank J. Nuzzi
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L21/70

Abstract:
A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.
Public/Granted literature
- US20080240893A1 HIGH CAPACITY PICK AND PLACE PROCESS Public/Granted day:2008-10-02
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