Invention Grant
- Patent Title: Modular shoe
- Patent Title (中): 模组鞋
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Application No.: US12164654Application Date: 2008-06-30
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Publication No.: US07730637B2Publication Date: 2010-06-08
- Inventor: Wolfgang Scholz
- Applicant: Wolfgang Scholz
- Applicant Address: NL Amsterdam
- Assignee: adidas International Marketing B.V.
- Current Assignee: adidas International Marketing B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Goodwin Procter LLP
- Priority: DE102004011680 20040310
- Main IPC: A43C15/02
- IPC: A43C15/02

Abstract:
A modular shoe includes an upper with an upper side and a lower side, a chassis releasably arranged in an interior of the upper, and a plurality of studs. Each stud is releasably attached to the chassis through the lower side of the upper. The lower side of the upper is clamped between the chassis and at least one of the attached studs. The invention also relates to the various components used in a modular shoe in accordance with the invention.
Public/Granted literature
- US20080263904A1 Modular Shoe Public/Granted day:2008-10-30
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