Invention Grant
- Patent Title: Ultrasonic sensor and manufacture method of the same
- Patent Title (中): 超声波传感器及其制造方法相同
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Application No.: US11790298Application Date: 2007-04-24
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Publication No.: US07730785B2Publication Date: 2010-06-08
- Inventor: Hiroyuki Wado , Makiko Sugiura
- Applicant: Hiroyuki Wado , Makiko Sugiura
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2006-122577 20060426; JP2006-122578 20060426
- Main IPC: G01N9/24
- IPC: G01N9/24 ; H01L41/00
Abstract:
An ultrasonic sensor is provided with a substrate unit where a thin-walled portion is arranged and a piezoelectric oscillator which is formed at the substrate unit. The piezoelectric oscillator includes two electrodes and a piezoelectric film positioned between the two electrodes. The thin-walled portion and the piezoelectric oscillator construct a membrane structure which will resonate at a predetermined frequency.
Public/Granted literature
- US20070251324A1 Ultrasonic sensor and manufacture method of the same Public/Granted day:2007-11-01
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