Invention Grant
US07730815B2 Vibration body for cutting, processing device, molding die and optical element
失效
振动体用于切割，加工装置，成型模具和光学元件
- Patent Title: Vibration body for cutting, processing device, molding die and optical element
- Patent Title (中): 振动体用于切割，加工装置，成型模具和光学元件
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Application No.: US11702171Application Date: 2007-02-05
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Publication No.: US07730815B2Publication Date: 2010-06-08
- Inventor: Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda , Isao Takano
- Applicant: Toshiyuki Imai , Shigeru Hosoe , Hiroyuki Matsuda , Isao Takano
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta Opto, Inc.
- Current Assignee: Konica Minolta Opto, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-031328 20060208
- Main IPC: B23B7/00
- IPC: B23B7/00 ; B23B29/02
Abstract:
In the assembly of vibration body, the first width in the lateral direction (X axis direction) is greater than the second width in the longitudinal direction (Y axis direction) in the cross sectional form perpendicular to Z axis of the first portion on the tip side from the closest node position, thereby, the rigidity of a vibration body main part in the X axis direction can be enhanced, and lateral bending vibrations on fixing portion can be restrained.Consequently, an object can be processed highly accurately by the assembly of vibration body that is controlled with a high precision.
Public/Granted literature
- US20070180961A1 Vibration body for cutting, processing device, molding die and optical element Public/Granted day:2007-08-09
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