A novel semiconductor wafer lifter is disclosed for handling wafers during wet bench processing. In particular, the lifter has a plurality of holes formed in its vertical support surface to allow cleaning or rinsing fluid to flow through the vertical support instead of around its sides. These holes facilitates a constant flow of fluid across the wafer during recirculation of the tank contents during etching and rinsing operations, thus ensuring more even etching of all wafers and minimizing the deposition of particulate matter on wafer surfaces.