Invention Grant
US07731034B2 Electronic part supplying tape and electronic part supplying tape connecting method
有权
电子零件供应胶带和电子零件供应胶带连接方法
- Patent Title: Electronic part supplying tape and electronic part supplying tape connecting method
- Patent Title (中): 电子零件供应胶带和电子零件供应胶带连接方法
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Application No.: US10705344Application Date: 2003-11-10
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Publication No.: US07731034B2Publication Date: 2010-06-08
- Inventor: Hidehiro Saho
- Applicant: Hidehiro Saho
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2002-331885 20021115
- Main IPC: B65D85/00
- IPC: B65D85/00

Abstract:
In a carrier tape for supplying an electronic part to an electronic part mounting apparatus for taking out the electronic part from a tape feeder to mount to a board, a tail side connecting portion having a cutout portion is provided to a tail side of the carrier tape mounted to the tape feeder, a front side connecting portion having a chipped portion is provided to a head side of the carrier tape to be used newly, respectively, and in tape splicing operation when a reel is interchanged, the cutout portion is fitted to the chipped portion and adhesive tapes are pasted thereon from two upper and lower faces thereof. Thereby, the tail side connecting portion and the head side connecting portion can be positioned in a longitudinal direction, a width direction and a thickness direction of the tape and held to each other and can efficiently be connected without using an exclusive connecting jig.
Public/Granted literature
- US20040094451A1 Electron part supplying tape and electron part supplying tape connecting method Public/Granted day:2004-05-20
Information query
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