Invention Grant
US07731341B2 Continuous fluid jet ejector with anisotropically etched fluid chambers
有权
具有各向异性蚀刻流体室的连续流体喷射喷射器
- Patent Title: Continuous fluid jet ejector with anisotropically etched fluid chambers
- Patent Title (中): 具有各向异性蚀刻流体室的连续流体喷射喷射器
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Application No.: US11220514Application Date: 2005-09-07
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Publication No.: US07731341B2Publication Date: 2010-06-08
- Inventor: David P. Trauernicht , Christopher N. Delametter , John A. Lebens , James M. Chwalek , Gary A. Kneezel
- Applicant: David P. Trauernicht , Christopher N. Delametter , John A. Lebens , James M. Chwalek , Gary A. Kneezel
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent William R. Zimmerli
- Main IPC: B41J2/02
- IPC: B41J2/02

Abstract:
A fluid ejection device, a method of cleaning the device, and a method of operating the device are provided. The device includes a substrate having a first surface and a second surface located opposite the first surface. A nozzle plate is formed over the first surface of the substrate and has a nozzle through which fluid is ejected. A drop forming mechanism is situated at the periphery of the nozzle. A fluid chamber is in fluid communication with the nozzle and has a first wall and a second wall. The first wall and the second wall are positioned at an angle other than 90° relative to each other. A fluid delivery channel is formed in the substrate and extends from the second surface of the substrate to the fluid chamber. The fluid delivery channel is in fluid communication with the fluid chamber.
Public/Granted literature
- US20070052766A1 Continuous fluid jet ejector with anisotropically etched fluid chambers Public/Granted day:2007-03-08
Information query
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