Invention Grant
- Patent Title: Sheet bundle printer and sheet bundle printing system
- Patent Title (中): 纸捆打印机和纸张捆打印系统
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Application No.: US11842794Application Date: 2007-08-21
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Publication No.: US07731438B2Publication Date: 2010-06-08
- Inventor: Hideki Sakano
- Applicant: Hideki Sakano
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Hogan & Hartson LLP
- Priority: JP2006-232744 20060829
- Main IPC: B41J13/02
- IPC: B41J13/02 ; B41J13/03 ; B41J33/54

Abstract:
A sheet bundle printer peeling off and performing printing on an uppermost sheet of a peelably adhered sheet bundle includes a print head performing printing on the sheet, a platen roller, at a print position, cooperating with the print head to feed both the sheet and an ink ribbon, pinched therebetween, and a platen moving mechanism moving the platen roller between the print position and a non-print position. The platen moving mechanism includes a manual operation device manually moving the platen roller from the print to non-print positions and a press roller that made to contact or moved away from the platen roller by the manual operation device to move the platen roller from the print to non-print positions while pressing it when the press roller contacts it. At the non-print position, the sheet is allowed to pass between the press roller and the platen roller.
Public/Granted literature
- US20080056796A1 Sheet Bundle Printer and Sheet Bundle Printing System Public/Granted day:2008-03-06
Information query
IPC分类: