A connector device for interconnecting circuit substrates is provided, in which no electric element for protection needs to be mounted separately on circuit substrates. A rectangular parallelepiped connecting element having an electrical component (9) is received in a connector housing (11). The rectangular parallelepiped connecting element having an electrical component (9) includes a plurality of first electrically conducting path portions (17a) and a plurality of second electrically conducting path portions (17b) disposed on a rectangular parallelepiped insulating base (13), and a plurality of electric elements (19) that are electrically connected in series with the plurality of first electrically conducting path portions (17a) and the plurality of second electrically conducting path portions (17b). The connector housing (11) is configured to allow the plurality of first electrically conducting path portions (17a) to be electrically connected to a plurality of first connecting electrodes (3) of a first circuit substrate (1), and bring a plurality of second connecting electrodes (7) on a second circuit substrate (5) into contact with the plurality of second electrically conducting path portions (17b).