Invention Grant
- Patent Title: Microelectronic contact structure
- Patent Title (中): 微电子接触结构
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Application No.: US11228966Application Date: 2005-09-16
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Publication No.: US07731546B2Publication Date: 2010-06-08
- Inventor: Gary W. Grube , Gaetan L. Mathieu , Alec Madsen
- Applicant: Gary W. Grube , Gaetan L. Mathieu , Alec Madsen
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: H01R13/24
- IPC: H01R13/24

Abstract:
A probing apparatus can include a plurality of contact probes, which can be of a type that is disposed along an axis. Each contact probe can include a contact portion, a base portion, and resilient portion. Multiple arms can form the resilient portion, which can be disposed between the contact portion and the base portion. The contact probes can be configured to twist when compressed. The probing apparatus can also include a substrate with through holes, and the contact probes can be inserted into the through holes. The resilient portion of each of the contact probes can bias the contact portion such that at least a portion of the contact portion extends out of a through hole.
Public/Granted literature
- US20070270041A1 Microelectronic contact structure Public/Granted day:2007-11-22
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