Invention Grant
US07732003B2 Bank forming method, wiring pattern forming method, electro-optical device, and electronic apparatus
有权
银行形成方法，布线图案形成方法，电光装置和电子装置
- Patent Title: Bank forming method, wiring pattern forming method, electro-optical device, and electronic apparatus
- Patent Title (中): 银行形成方法，布线图案形成方法，电光装置和电子装置
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Application No.: US10898184Application Date: 2004-07-26
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Publication No.: US07732003B2Publication Date: 2010-06-08
- Inventor: Naoyuki Toyoda
- Applicant: Naoyuki Toyoda
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-290656 20030808
- Main IPC: B05D5/12
- IPC: B05D5/12
Abstract:
Aspects of the invention can provide a bank forming method capable of forming banks having a good shape with excellent productivity. Banks for partitioning a predetermined area of a base member can be formed on the base member by radiating light onto the base member on which a sublimation layer containing a sublimation material is formed and sublimating the sublimation material.
Public/Granted literature
- US20050058840A1 Bank forming method, wiring pattern forming method, electro-optical device, and electronic apparatus Public/Granted day:2005-03-17
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