Invention Grant
- Patent Title: Shaped absorbent pads
- Patent Title (中): 成型吸收垫
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Application No.: US10802254Application Date: 2004-03-17
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Publication No.: US07732036B2Publication Date: 2010-06-08
- Inventor: Marc D. Etchells
- Applicant: Marc D. Etchells
- Applicant Address: US CA LaVerne
- Assignee: Paper-Pak Industries
- Current Assignee: Paper-Pak Industries
- Current Assignee Address: US CA LaVerne
- Agency: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- Main IPC: B32B1/04
- IPC: B32B1/04 ; B32B3/02 ; A61F13/15 ; A61F13/20
Abstract:
There is provided an absorbent pad with contoured and/or complex shapes, and/or an absorbent pad having a single, double, or multi-layer islands. There is also provided methods for manufacturing such absorbent pads.
Public/Granted literature
- US20040267223A1 Shaped absorbent pads Public/Granted day:2004-12-30
Information query
