Invention Grant
US07732037B2 Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
失效
导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
- Patent Title: Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
- Patent Title (中): 导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
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Application No.: US10557003Application Date: 2005-01-25
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Publication No.: US07732037B2Publication Date: 2010-06-08
- Inventor: Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
- Applicant: Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
- Applicant Address: JP Kyoto JP Aichi
- Assignee: Towa Corporation,Japan Fine Chemicals Center
- Current Assignee: Towa Corporation,Japan Fine Chemicals Center
- Current Assignee Address: JP Kyoto JP Aichi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2004-031678 20040209
- International Application: PCT/JP2005/000902 WO 20050125
- International Announcement: WO2005/075380 WO 20050818
- Main IPC: B32B3/24
- IPC: B32B3/24 ; C04B38/02 ; B29C33/38
Abstract:
A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.
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