Invention Grant
US07732238B2 Method of manufacturing an image sensing apparatus in which two members are bonded together
有权
制造其中两个构件结合在一起的图像感测装置的方法
- Patent Title: Method of manufacturing an image sensing apparatus in which two members are bonded together
- Patent Title (中): 制造其中两个构件结合在一起的图像感测装置的方法
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Application No.: US11381267Application Date: 2006-05-02
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Publication No.: US07732238B2Publication Date: 2010-06-08
- Inventor: Yoshinobu Sekiguchi , Takao Yonehara
- Applicant: Yoshinobu Sekiguchi , Takao Yonehara
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2003-154898 20030530
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A solid-state image sensing apparatus having a three-dimensional structure whose manufacturing process can be simplified is provided. A solid-state image sensing apparatus formed by bonding a first member and a second member is provided. The first member has a first surface on the side of the bonding interface between the first member and the second member and a second surface on the opposite side of the bonding interface. The second member has a third surface on the bonding interface side and a fourth surface on the opposite side of the bonding interface. The first member includes photoelectric conversion elements which are formed on the first surface before the first member is bonded to the second member. The second member includes circuit elements which are formed on the third surface before bonding.
Public/Granted literature
- US20060199296A1 SOLID-STATE IMAGE SENSING APPARATUS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2006-09-07
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