Invention Grant
- Patent Title: Method for manufacturing solid-state image sensor
- Patent Title (中): 固态图像传感器的制造方法
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Application No.: US12050930Application Date: 2008-03-18
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Publication No.: US07732239B2Publication Date: 2010-06-08
- Inventor: Masatoshi Kimura , Hiroki Honda
- Applicant: Masatoshi Kimura , Hiroki Honda
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2007-104554 20070412
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method using a divided exposure technology is provided for restraining deterioration in the performance of a solid-state image sensor. A photoresist is formed over a semiconductor substrate and subjected to divided exposure. A dividing line for divided exposure is located at least over a region of a semiconductor substrate in which an active region in which a pixel is to be formed is defined. The photoresist is then developed and patterned. By utilizing the patterned photoresist, an element isolation structure for defining the active region in the semiconductor substrate is formed in the semiconductor substrate.
Public/Granted literature
- US20080254564A1 METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSOR AND SOLID-STATE IMAGE SENSOR Public/Granted day:2008-10-16
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