Invention Grant
US07732241B2 Microstructure and manufacturing method thereof and microelectromechanical system 失效
微结构及其制造方法及微机电系统

Microstructure and manufacturing method thereof and microelectromechanical system
Abstract:
An object is to provide a microstructure in which shear stress of a structural layer is increased, a manufacturing method thereof, and a microelectromechanical system. A sacrificial layer is formed over a substrate. A metal film is formed over the sacrificial layer. The metal film is irradiated with a laser beam. Needle-like crystals of the metal film are reduced or eliminated. The metal film is etched and processed into a predetermined shape to form a metal layer. Then, the sacrificial layer is removed. Accordingly, a microelectromechanical system which is excellent in reliability and in which a resistance property to breakage of a movable portion of the microstructure is improved can be provided.
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