Invention Grant
- Patent Title: Microstructure and manufacturing method thereof and microelectromechanical system
- Patent Title (中): 微结构及其制造方法及微机电系统
-
Application No.: US11562711Application Date: 2006-11-22
-
Publication No.: US07732241B2Publication Date: 2010-06-08
- Inventor: Mayumi Yamaguchi , Konami Izumi , Kojiro Shiraishi
- Applicant: Mayumi Yamaguchi , Konami Izumi , Kojiro Shiraishi
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Labortory Co., Ltd.
- Current Assignee: Semiconductor Energy Labortory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2005-345088 20051130
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
An object is to provide a microstructure in which shear stress of a structural layer is increased, a manufacturing method thereof, and a microelectromechanical system. A sacrificial layer is formed over a substrate. A metal film is formed over the sacrificial layer. The metal film is irradiated with a laser beam. Needle-like crystals of the metal film are reduced or eliminated. The metal film is etched and processed into a predetermined shape to form a metal layer. Then, the sacrificial layer is removed. Accordingly, a microelectromechanical system which is excellent in reliability and in which a resistance property to breakage of a movable portion of the microstructure is improved can be provided.
Public/Granted literature
- US20070238213A1 MICROSTRUCTURE AND MANUFACTURING METHOD THEREOF AND MICROELECTROMECHANICAL SYSTEM Public/Granted day:2007-10-11
Information query
IPC分类: