Invention Grant
US07732243B2 Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays 失效
集成串联光伏阵列的基板结构和这种阵列的制造工艺

  • Patent Title: Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
  • Patent Title (中): 集成串联光伏阵列的基板结构和这种阵列的制造工艺
  • Application No.: US12154078
    Application Date: 2008-05-19
  • Publication No.: US07732243B2
    Publication Date: 2010-06-08
  • Inventor: Daniel Luch
  • Applicant: Daniel Luch
  • Main IPC: H01L21/58
  • IPC: H01L21/58 H01L21/60
Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
Abstract:
This invention comprises manufacture of photovoltaic cells by deposition of thin film photovoltaic junctions on metal foil substrates. The photovoltaic junctions may be heat treated if appropriate following deposition in a continuous fashion without deterioration of the metal support structure. In a separate operation, an interconnection substrate structure is provided, optionally in a continuous fashion. Multiple photovoltaic cells are then laminated to the interconnection substrate structure and conductive joining methods are employed to complete the array. In this way the interconnection substrate structure can be uniquely formulated from polymer-based materials employing optimal processing unique to polymeric materials. Furthermore, the photovoltaic junction and its metal foil support can be produced in bulk without the need to use the expensive and intricate material removal operations currently taught in the art to achieve series interconnections.
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