Invention Grant
- Patent Title: Semiconductive polymer composition
- Patent Title (中): 半导体聚合物组成
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Application No.: US11662151Application Date: 2005-09-09
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Publication No.: US07732711B2Publication Date: 2010-06-08
- Inventor: Anders Ericsson , Anders Gustafsson , Claes Broman , Lena Lindbom , Ulf Nilsson , Annika Smedberg , Alfred Campus , Roger Carlsson , Ola Fagrell , Jan-Ove Boström , Andreas Farkas , Peter Carstensen
- Applicant: Anders Ericsson , Anders Gustafsson , Claes Broman , Lena Lindbom , Ulf Nilsson , Annika Smedberg , Alfred Campus , Roger Carlsson , Ola Fagrell , Jan-Ove Boström , Andreas Farkas , Peter Carstensen
- Applicant Address: FI
- Assignee: Borealis Technology Oy
- Current Assignee: Borealis Technology Oy
- Current Assignee Address: FI
- Agency: Fay Sharpe LLP
- Priority: EP04021606 20040910
- International Application: PCT/EP2005/009721 WO 20050909
- International Announcement: WO2006/027262 WO 20060316
- Main IPC: H01B7/00
- IPC: H01B7/00

Abstract:
A semiconductive polymer composition for use in power cables, wherein the composition has a multimodal ethylene homo- or copolymer produced in a polymerization process having a single site catalyst whereby the polymer composition has a density of 870-930 kg/m3, a MFR2 of 1 to 30 g/10 min and a Mw/Mn of less than or equal to 10.
Public/Granted literature
- US20080190645A1 Semiconductive Polymer Composition Public/Granted day:2008-08-14
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