Invention Grant
- Patent Title: Method for measuring a pattern dimension using a scanning electron microscope
- Patent Title (中): 使用扫描电子显微镜测量图案尺寸的方法
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Application No.: US11673057Application Date: 2007-02-09
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Publication No.: US07732761B2Publication Date: 2010-06-08
- Inventor: Maki Tanaka , Chie Shishido
- Applicant: Maki Tanaka , Chie Shishido
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-038945 20060216
- Main IPC: G06F7/60
- IPC: G06F7/60 ; G06F17/10 ; G06F17/50 ; G06G7/48 ; G01N23/00 ; G21K7/00 ; G06G7/62

Abstract:
To provide a consistent, high-speed, high-precision measurement method based on an electron beam simulation by reflecting the apparatus characteristics of a CD-SEM in an electron beam simulation, the present invention discloses a method for measuring a measurement target pattern with a CD-SEM, the method comprising the steps of performing an electron beam simulation on various target pattern shapes, which is reflected apparatus characteristic and image acquisition conditions; creating SEM simulated waveforms; storing a combination of the created SEM simulated waveforms and pattern shape information corresponding to the created SEM simulated waveforms as a library; comparing an acquired actual electron microscope image with the SEM simulated waveforms; selecting the SEM simulated waveform that is most similar to the actual electron microscope image; and estimating the shape of the measurement target pattern from the pattern shape information corresponding to the selected SEM simulated waveform.
Public/Granted literature
- US20070187595A1 METHOD FOR MEASURING A PATTERN DIMENSION USING A SCANNING ELECTRON MICROSCOPE Public/Granted day:2007-08-16
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