Invention Grant
US07732810B2 Methods for forming an undercut region and electronic devices incorporating the same
失效
形成底切区域的方法和包含该切削区域的电子装置
- Patent Title: Methods for forming an undercut region and electronic devices incorporating the same
- Patent Title (中): 形成底切区域的方法和包含该切削区域的电子装置
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Application No.: US11840392Application Date: 2007-08-17
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Publication No.: US07732810B2Publication Date: 2010-06-08
- Inventor: Nugent Truong , Charles Douglas Macpherson
- Applicant: Nugent Truong , Charles Douglas Macpherson
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L51/50
- IPC: H01L51/50
Abstract:
An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.
Public/Granted literature
- US20080210931A1 METHODS FOR FORMING AN UNDERCUT REGION AND ELECTRONIC DEVICES INCORPORATING THE SAME Public/Granted day:2008-09-04
Information query
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