Invention Grant
- Patent Title: Semiconductor ESD device and method of making same
- Patent Title (中): 半导体ESD器件及其制造方法
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Application No.: US11698674Application Date: 2007-01-26
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Publication No.: US07732834B2Publication Date: 2010-06-08
- Inventor: Cornelius Christian Russ , Kai Esmark , David Alvarez , Jens Schneider
- Applicant: Cornelius Christian Russ , Kai Esmark , David Alvarez , Jens Schneider
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/74
- IPC: H01L29/74

Abstract:
A semiconductor device includes an ESD device region disposed within a semiconductor body of a first semiconductor type, an isolation region surrounding the ESD device region, a first doped region of a second conductivity type disposed at a surface of the semiconductor body within the ESD region, and a second doped region of the first conductivity type disposed between the semiconductor body within the ESD region and at least a portion of the first doped region, where the doping concentration of the second doped region is higher than the semiconductor body. A third doped region of the second semiconductor type is disposed on the semiconductor body and a fourth region of the first conductivity type is disposed over the third doped region. A fifth doped region of the second conductivity type is disposed on the semiconductor body. A trigger device and an SCR is formed therefrom.
Public/Granted literature
- US20080179624A1 Semiconductor ESD device and method of making same Public/Granted day:2008-07-31
Information query
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