Invention Grant
- Patent Title: Integrated circuit package system with edge connection system
- Patent Title (中): 具有边缘连接系统的集成电路封装系统
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Application No.: US11421051Application Date: 2006-05-30
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Publication No.: US07732907B2Publication Date: 2010-06-08
- Inventor: Byung Joon Han , Il Kwon Shim , Seng Guan Chow
- Applicant: Byung Joon Han , Il Kwon Shim , Seng Guan Chow
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An integrated circuit package system including a plurality of substrates and a plurality of semiconductor devices formed on each of the substrates. An edge connection system is provided and an electrical edge connector on each of the substrates is for attachment to the edge connection system. A vertically stacked configuration of the substrates is formed by attaching the substrates to the edge connection system.
Public/Granted literature
- US20070278660A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EDGE CONNECTION SYSTEM Public/Granted day:2007-12-06
Information query
IPC分类:
