Invention Grant
- Patent Title: Simultaneous grain modulation for BEOL applications
- Patent Title (中): BEOL应用的同时粒度调制
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Application No.: US11970149Application Date: 2008-01-07
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Publication No.: US07732922B2Publication Date: 2010-06-08
- Inventor: Chih-Chao Yang , Louis C. Hsu , Rajiv V. Joshi
- Applicant: Chih-Chao Yang , Louis C. Hsu , Rajiv V. Joshi
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Lisa U. Jaklitsch; Katherine S. Brown
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
The invention is directed to an improved semiconductor structure, such that within the same insulating layer, Cu interconnects embedded within the same insulating level layer have a different Cu grain size than other Cu interconnects embedded within the same insulating level layer.
Public/Granted literature
- US20090174075A1 SIMULTANEOUS GRAIN MODULATION FOR BEOL APPLICATIONS Public/Granted day:2009-07-09
Information query
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