Invention Grant
- Patent Title: Semiconductor device having conductive adhesive layer and method of fabricating the same
- Patent Title (中): 具有导电粘合剂层的半导体器件及其制造方法
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Application No.: US11806586Application Date: 2007-06-01
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Publication No.: US07732934B2Publication Date: 2010-06-08
- Inventor: Yun-rae Cho
- Applicant: Yun-rae Cho
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0057092 20060623
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
In a semiconductor device, a semiconductor substrate may include a plurality of first conductive pads. An insulating isolation layer may be on the semiconductor substrate so as to separate the first conductive pads. A package substrate may include a plurality of second conductive pads. A conductive adhesive layer may connect the first conductive pads and the second conductive pads.
Public/Granted literature
- US20070296082A1 Semiconductor device having conductive adhesive layer and method of fabricating the same Public/Granted day:2007-12-27
Information query
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