Invention Grant
- Patent Title: Low force interconnects for probe cards
- Patent Title (中): 用于探针卡的低力互连
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Application No.: US12106827Application Date: 2008-04-21
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Publication No.: US07733104B2Publication Date: 2010-06-08
- Inventor: John McGlory , Anh-Tai Thai Nguyen , John William Clancy, III , Senthil Theppakuttai , Bahadir Tunaboylu
- Applicant: John McGlory , Anh-Tai Thai Nguyen , John William Clancy, III , Senthil Theppakuttai , Bahadir Tunaboylu
- Applicant Address: SG Singapore
- Assignee: SV Probe Pte. Ltd.
- Current Assignee: SV Probe Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Hickman Palermo Truong & Becker LLP
- Agent Edward A. Becker
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A probe test card assembly for testing of a device under test includes a printed circuit board, a substrate and a substrate support structure. The substrate support structure holds the substrate in position with respect to the printed circuit board. The substrate support structure may include one or more alignment members, one or more hard stop members and/or a support plate attached to the printed circuit board for positioning the substrate with respect to the printed circuit board. The one or more alignment members may extend through the printed circuit board and be connected to the one or more printed circuit board stiffener members. The probe test card assembly may also employ a proximity detection feature to indicate when the substrate is in a particular position with respect to the printed circuit board.
Public/Granted literature
- US20090261849A1 Low Force Interconnects For Probe Cards Public/Granted day:2009-10-22
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