Invention Grant
US07733397B2 Sensor surface with 3D curvature formed by electronics on a continuous 2D flexible substrate
有权
传感器表面具有由连续2D柔性基板上的电子元件形成的3D曲率
- Patent Title: Sensor surface with 3D curvature formed by electronics on a continuous 2D flexible substrate
- Patent Title (中): 传感器表面具有由连续2D柔性基板上的电子元件形成的3D曲率
-
Application No.: US11644056Application Date: 2006-12-22
-
Publication No.: US07733397B2Publication Date: 2010-06-08
- Inventor: Jeng Ping Lu , Christopher L. Chua
- Applicant: Jeng Ping Lu , Christopher L. Chua
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Marger Johnson & McCollum, P.C.
- Main IPC: H04N3/14
- IPC: H04N3/14
Abstract:
A method of making a curved sensor is described. The method involves projecting portions of a curved three dimensional structure such as a hemisphere onto a two dimensional substrate in an outline pattern. The outline pattern typically serves as a perimeter of a sensor. After forming a sensor in the shape of the outline pattern, the two dimensional substrate is flexed to form a three dimensional sensor structure.
Public/Granted literature
- US20080151084A1 Sensor surface with 3D curvature formed by electronics on a continuous 2D flexible substrate Public/Granted day:2008-06-26
Information query
