Invention Grant
- Patent Title: Roughness evaluation method and system
- Patent Title (中): 粗糙度评估方法和系统
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Application No.: US11971404Application Date: 2008-01-09
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Publication No.: US07733502B2Publication Date: 2010-06-08
- Inventor: Tsuyoshi Moriya , Machi Moriya
- Applicant: Tsuyoshi Moriya , Machi Moriya
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-002101 20070110
- Main IPC: G01B11/30
- IPC: G01B11/30

Abstract:
A roughness evaluation method for evaluating a roughness of lines formed on a substrate includes a measuring step of irradiating light onto a plurality of locations of the substrate and measuring a state of reflected light by a scatterometry; and an analyzing step of evaluating the roughness of the lines based on a variation in value measured in the measuring step. A roughness evaluation system includes an optical device for irradiating light onto the substrate and measuring a state of reflected light by a scatterometry; a moving device for moving the substrate in at least one of an x-direction and a y-directions on a horizontal plane; a controller for controlling the moving device such that the optical device measures a plurality of locations on the substrate; and an analysis unit for evaluating the roughness based on a variation in measured values at the plurality of locations on the substrate.
Public/Granted literature
- US20080165367A1 ROUGHNESS EVALUATION METHOD AND SYSTEM Public/Granted day:2008-07-10
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