Invention Grant
- Patent Title: Supporting mechanism
- Patent Title (中): 配套机制
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Application No.: US11765624Application Date: 2007-06-20
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Publication No.: US07733566B2Publication Date: 2010-06-08
- Inventor: Shigeo Enomoto , Makoto Niwa
- Applicant: Shigeo Enomoto , Makoto Niwa
- Applicant Address: JP Tokyo
- Assignee: Hoya Corporation
- Current Assignee: Hoya Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2006-171397 20060621
- Main IPC: G02B27/64
- IPC: G02B27/64
Abstract:
A supporting mechanism comprises a movable unit and a fixed unit. The movable unit is movable in a reference plane. The fixed unit has a rectangular frame that is connected with the movable unit, that is composed of strips perpendicular to the reference plane, and that is fixed to another part of the fixed unit. The fixed unit movably supports the movable unit through an elastic transformation of the rectangular frame.
Public/Granted literature
- US20070297055A1 SUPPORTING MECHANISM Public/Granted day:2007-12-27
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