A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components (3) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs (2) arranged at the ends of the lower surface of the substrate (1), each insulating leg extending in parallel to the lower surface of the substrate (1); and a plurality of terminal electrodes (5) formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate (1). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes. Each leg is fixed to the substrate by attaching the terminal electrodes to the wiring patterns on the lower surface of the substrate (1) by soldering or by an electroconductive paste.