Invention Grant
US07733691B2 Memory device including thermal conductor located between programmable volumes
有权
存储器件包括位于可编程体积之间的导热体
- Patent Title: Memory device including thermal conductor located between programmable volumes
- Patent Title (中): 存储器件包括位于可编程体积之间的导热体
-
Application No.: US11959502Application Date: 2007-12-19
-
Publication No.: US07733691B2Publication Date: 2010-06-08
- Inventor: Young-Tae Kim , Myung-Jin Park , Keun-Ho Lee
- Applicant: Young-Tae Kim , Myung-Jin Park , Keun-Ho Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2007-0002149 20070108
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
In one aspect, a memory device is provided which includes a plurality of bit lines extending in a first direction, a plurality of word lines extending in a second direction, an array of programmable volumes electrically connected between the bit lines and word lines, and thermally conductive striped patterns located between the programmable volumes of the array and extending in at least one of the first and second directions.
Public/Granted literature
- US20080165574A1 MEMORY DEVICE INCLUDING THERMAL CONDUCTOR LOCATED BETWEEN PROGAMMABLE VOLUMES Public/Granted day:2008-07-10
Information query